CeramicCutting

Guanghong laser processing center has launched laser cutting of various ceramics, such as: cooked ceramics, raw ceramics, drilling or slotting, etc.

Processing thickness: 0.05-2.5mm

Minimum opening ratio (aspect ratio) 1 : 1

No cracks and burrs on the cutting edge

Fully automatic visual alignment to ensure product processing accuracy +/-0.005mm

No burning and discoloration on the surface

Processed ceramic types:

LTCC Low Temperature Co-Fired Multilayer Ceramic Substrates (Green Ceramics)

HTCC high temperature co-fired multilayer ceramics (cooked ceramics)

DBC direct copper clad ceramic substrate

DPC direct copper plated substrate