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It is the best choice for Fine Pitch lead-free solder paste printing such as 01005, 0201, 0402/, CSP, uBGA, QFP, etc., which can significantly reduce bad printing such as solder balls, less tin, and empty soldering;
It is especially suitable for mass SMT printing and can maintain a high yield rate.
◆ Technical indicators:
Hole size accuracy: ± 0.005 mm
Maximum position deviation: ± 0.010 mm
Thickness error: ± 0.005 mm
Hole wall roughness: < 0.0003 mm
Nickel Alloy Hardness: 500 ~ 560 Hv
◆ Features:
The hole wall is smooth and the tapered section is favorable for solder paste release; the surface energy level of electroformed nickel alloy is low, which reduces the adhesion of solder paste;
The surface hardness can reach 500~560HV, prolonging the service life of the template;
According to customer needs, 20-300um thickness templates can be provided; STEP DOWN / STEP UP suitable for connectors and other special requirements.
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