The COB template is designed to meet the good tinning effect on other pads on the PCB board with bonding IC. This kind of template is made by electroforming method. In addition to the advantages of ordinary electroforming templates, there are The upper surface of the stencil at the position of the bonding IC will bulge, forming a cavity, which effectively protects the bonding IC from tinning, and at the same time ensures that the pads at other positions are in contact with the stencil during the tin printing process. The plate is in close contact, so that there is a good tin printing effect. It is best to use a rubber scraper for this type of template.