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SIP stencil introduction:
According to the definition of the International Semiconductor Route Organization (ITRS): SIP (System-in-package) is the priority assembly of multiple active electronic components with different functions and optional passive components, as well as other components such as MEMS or optical devices. Together, a single standard package that realizes certain functions forms a system or subsystem. To put it simply, the SIP module is a full-featured system or subsystem that integrates one or more IC chips and passive components into a package to achieve a basically complete function. SIP stencil is a high-precision printed stencil specially designed by our company for SIP packaging.
Features of SIP stencil:
①The stencil is ultra-thin that the thickness is below 0.04mm, usually a ultra-thin thickness stencil to printed FLUX, and also to coordinate with a stepped stencil at the bottom to printed solder paste;
②Easy to fold and deform, and the machining accuracy is difficult to control than conventional stencil. Under the Konwin's unique technical control, we could control the position accuracy within 20um for the range of length about 250mm ;
③SIP stencil has smallest holes, many holes and densely, also a longer processing time;
④Because the stencil is thin and easy to stretched, the post-treatment process is complicated, which is completely different from the conventional stencil.
⑤The unique MicroCut+ electro-polishing technology allows the SIP stencil to obtain better hole walls and better effect for the solder paste printing.
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