Partially thicken the template to increase or reduce the amount of tin when soldering specific components and avoid local raised parts on the PCB to ensure close contact between the PCB and the template during the printing process. This process template is especially suitable for perforated reflow soldering process (ie plug-in component reflow soldering).
This process template partially thins and thickens the template, that is, there are different thicknesses on the same template to meet the different requirements for the amount of tin when welding different components.
SMT testing kit is mainly used for PCBA production process inspection, which is an effective quality control method. Made of new anti-static material, it has high toughness and is not easy to be discounted. It can also achieve high precision for smaller components.
It is the best choice for Fine Pitch lead-free solder paste printing such as 01005, 0201, 0402/, CSP, uBGA, QFP, etc., which can significantly reduce bad printing such as solder balls, less tin, and empty soldering;
It is especially suitable for mass SMT printing and can maintain a high yield rate.
◆ Technical indicators:
Hole size accuracy: ± 0.005 mm
Maximum position deviation: ± 0.010 mm
Thickness error: ± 0.005 mm
Hole wall roughness: < 0.0003 mm
Nickel Alloy Hardness: 500 ~ 560 Hv
The hole wall is smooth and the tapered section is favorable for solder paste release; the surface energy level of electroformed nickel alloy is low, which reduces the adhesion of solder paste;
The surface hardness can reach 500~560HV, prolonging the service life of the template;
According to customer needs, 20-300um thickness templates can be provided; STEP DOWN / STEP UP suitable for connectors and other special requirements.
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