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SIP钢网介绍：
根据国际半导体路线组织（ITRS）的定义： SIP(System-in-package)为将多个具有不同功能的有源电子元件与可选无源器件，以及诸如MEMS或光学器件等其他器件优先组装到一起，实现一定功能的单个标准封装件，形成一个系统或子系统。简单点说，SIP模组是一个功能齐全的全系统或子系统，它将一个或多个IC芯片及被动元件整合在一个封装中，从而实现一个基本完整的功能。SIP钢网是我司专门针对SIP封装而设计的高精密印刷钢网。
SIP stencil introduction:
According to the definition of the International Semiconductor Route Organization (ITRS): SIP (System-in-package) is the priority assembly of multiple active electronic components with different functions and optional passive components, as well as other components such as MEMS or optical devices. Together, a single standard package that realizes certain functions forms a system or subsystem. To put it simply, the SIP module is a full-featured system or subsystem that integrates one or more IC chips and passive components into a package to achieve a basically complete function. SIP stencil is a high-precision printed stencil specially designed by our company for SIP packaging.
1. SIP钢网的特点：
① 材料超薄，通常厚度在0.04mm以下，通常会开一张超薄厚度的钢网印刷FLUX,再配套一张底部避让的阶梯钢网来印刷锡膏；
②易折、易变形，加工精度较常规钢网更难控制,得益于光宏独有的技术管控，我们可以将250MM长度范围的位置精度误差控制在20um内；
③SIP板孔小、孔多而且密集，加工时间长；
④因钢片薄、容易拉伸，故后处理工序复杂，完全不同于常规钢网。
⑤独有的MicroCut+电抛光技术，让SIP钢网获得更好的孔壁，保证下锡效果。
Features of SIP stencil:
①The stencil is ultra-thin that the thickness is below 0.04mm, usually a ultra-thin thickness stencil to printed FLUX, and also to coordinate with a stepped stencil at the bottom to printed solder paste;
②Easy to fold and deform, and the machining accuracy is difficult to control than conventional stencil. Under the Konwin's unique technical control, we could control the position accuracy within 20um for the range of length about 250mm ;
③SIP stencil has smallest holes, many holes and densely, also a longer processing time;
④Because the stencil is thin and easy to stretched, the post-treatment process is complicated, which is completely different from the conventional stencil.
⑤The unique MicroCut+ electro-polishing technology allows the SIP stencil to obtain better hole walls and better effect for the solder paste printing.
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